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Rogers CuClad 217 DK2.17/2.20 Df0.0009 Copper Clad Laminate
Brief Introduction
CuClad® 217 is a PTFE/woven fiberglass reinforced laminate designed for high-performance microwave printed circuit board applications. It offers true electrical and mechanical isotropy in the XY plane—a unique feature among fiberglass-reinforced PTFE laminates—making it ideal for phase-sensitive circuits such as phased array antennas.
Technical Features & Benefits
Ultra-Low Dielectric Constant: Dk = 2.17 (also available as 2.20) at 10 GHz, enabling faster signal propagation and improved signal-to-noise ratio.
Extremely Low Loss: Dissipation factor of 0.0009 at 10 GHz, suitable for high-frequency, low-loss designs.
True XY Isotropy: Cross-plied woven fiberglass ensures uniform electrical and mechanical properties in the plane of the board.
Excellent Thermal Stability: Low thermal coefficient of Dk (–160 ppm/°C) and low CTE for reliable performance across temperature ranges.
High Electrical Insulation: Volume resistivity up to 2.3×10⁸ MΩ·cm, ensuring superior isolation in RF circuits.
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Typical Properties
| Property |
Test Method |
Condition |
CuClad 217 |
| Dielectric Constant @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 |
| Dielectric Constant @1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.17, 2.20 |
| Dissipation Factor @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0009 |
| Thermal Coefficient of Er | IPC TM-650 2.5.5.5 Adapted | –10°C to +140°C | –160 ppm/°C |
| Peel Strength (lbs/in) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Volume Resistivity (MΩ·cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 2.3×10⁸ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 3.4×10⁶ |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 275, 219 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 8.8, 6.6 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 237 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 357 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Specific Gravity (g/cm³) | ASTM D-792 Method A | A, 23°C | 2.23 |
| Water Absorption (%) | MIL-S-13949H 3.7.7 / IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.02 |
| CTE (ppm/°C) – X Axis | IPC TM-650 2.4.24 (Mettler 3000 TMA) | 0°C to 100°C | 29 |
| CTE (ppm/°C) – Y Axis | IPC TM-650 2.4.24 (Mettler 3000 TMA) | 0°C to 100°C | 28 |
| CTE (ppm/°C) – Z Axis | IPC TM-650 2.4.24 (Mettler 3000 TMA) | 0°C to 100°C | 246 |
| Thermal Conductivity (W/m·K) | ASTM E-1225 | 100°C | 0.26 |
| Outgassing – TML (%) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | 0.01 |
| Outgassing – CVCM (%) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | 0.01 |
| Outgassing – WVR (%) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | 0.00 |
| Visible Condensate | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | NO |
| Flammability | UL 94 Vertical Burn / IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets UL94-V0 |
Application Areas
Military & Defense Electronics: Radars, ECM (Electronic Countermeasures), ESM (Electronic Support Measures).
Microwave Components: Low-Noise Amplifiers (LNAs), filters, couplers, power dividers.
Phased Array Antennas: Where XY isotropy and stable Dk are critical.
Aerospace & Satellite Systems: High-frequency communication payloads.
Test & Measurement: Calibration substrates and RF probe cards.
Available Configurations
Copper Cladding: ½ oz, 1 oz, or 2 oz electrodeposited copper on both sides; rolled copper also available.
Panel Sizes: 36" × 36" (cross-plied) or 36" × 48" (parallel-plied).
Metal-Backed Options: Bonded to aluminum, brass, or copper plates for heat sinking and mechanical support.
Testing Grade: "LX" grade available with individual sheet testing and certification.
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